TE Connectivity - Experts & Thought Leaders

TE Connectivity, a world renowned company in connectivity and sensors, has acquired Harger, an American major firm in lightning protection and grounding solutions for IEEE markets. Grounding solutions are the cornerstone of grid reliability, enhance both the safety and functionality of the entire electrical system and form a critical component of a solar farm’s electrical balance of system (EBoS). TE Connectivity acquires Harger With this strategic acquisition, TE’s energy business unit serves customers with a broader portfolio for grid reliability With this strategic acquisition, TE’s energy business unit serves customers with a broader portfolio for grid reliability and connectivity solutions in renewable power, utilities, and industrial applications. “Harger is an attractive addition to the TE portfolio because of its proven market reputation and strong customer service. I am pleased to welcome the talented Harger team to TE and create our new engineering and manufacturing competence center for lightning protection and grounding solutions,” said Bart Otten, Senior Vice President and General Manager of TE’s energy business unit. TE Connectivity expands energy portfolio Bart Otten adds, “Adding Harger to our portfolio enhances the value we bring to our customers as one connectivity partner. This acquisition is a critical milestone in our strategic vision to be partner of choice for innovating sustainable energy networks that keep the power on.” “For 64 years, Harger has been an expert in lightning protection and grounding solutions and services, ensuring the reliability of the power grid infrastructure in North America,” said Mark Harger, Steward of the Company and Son of the Founder. Mark Harger adds, “Under TE, customers will benefit from service continuity and ongoing investment in new product development. I am excited for the future of the Harger business.”

The Board of Directors of TE Connectivity plc, a world pioneer in connectivity and sensors, has appointed Sam Eldessouky, Executive Vice President and Chief Financial Officer of Bausch + Lomb Corporation to the board, effective Oct. 4, 2024. "We are very pleased to have Sam join as a new director to TE's board," said TE Connectivity Chairman - John Davidson, adding "He brings a range of valuable expertise to the board, including accounting and financial leadership at public companies." Sam Eldessouky Sam Eldessouky has served in his current role at Bausch + Lomb Corporation Sam Eldessouky has served in his current role at Bausch + Lomb Corporation, a global company that develops, manufactures, and markets a range of products, primarily in the areas of eye health, since January 2022. Before that, he was the Executive Vice President and Chief Financial Officer of Bausch Health Companies from 2021 to 2022 and Controller and Chief Accounting Officer from 2016 to 2021, responsible for overseeing the global controllership functions, including financial reporting, regional finance, and global policies. work experience Previously, Sam Eldessouky spent more than 12 years at Tyco International plc, most recently having served as Senior Vice President, Controller, and Chief Accounting Officer from 2012 to 2016. Before that, he spent 10 years at PwC, where he held several roles of increasing responsibility and served in PwC's National Office, providing technical accounting guidance on complex accounting matters. Sam Eldessouky holds a Bachelor of Science in Accountancy from Ain Shams University and a master's degree in accounting and finance from the University of Liverpool. He is a certified Public Accountant (inactive) and Chartered Global Management Accountant.

TE Connectivity (TE), a pioneer in connectivity and sensors, has expanded its VITA 66 optical backplane interconnect family with the new VITA 66.5 Style D optical modules. These high-density modules provide a rugged, blind-mate optical interconnect solution for aerospace, defense, and marine applications. The VITA 66.5 Style D optical modules feature up to 3 MT ferrules per insert and a floating receptacle design for optimal alignment. Available in full-size and half-size configurations, they offer versatility for various system designs. The modules are designed to withstand harsh environments and meet military and aerospace specifications. Embedded computing applications "The VITA 66.5 Style D, 3 MT optical modules address the growing need for higher data rates and bandwidth in embedded computing applications," said Anders Thelin, Product Manager at TE Connectivity. "This expansion of our VITA 66 family demonstrates our commitment to providing advanced connectivity solutions for challenging environments." Key benefits of the VITA 66.5 Style D, 3 MT optical modules include: Easy integration with common mounting interfaces for 3U and 6U VPX applications Rugged design based on proven optical termini for various applications High performance with up to 3 MT ferrules per insert and floating alignment capability The VITA 66.5 Style D, 3 MT optical modules are suitable for applications such as embedded computing, secure communications, avionics, radar and imaging systems. For more information on TE's VITA 66.5 Style D optical backplane interconnect system and the new Style D, 3 MT optical modules.