SEMIKRON - Experts & Thought Leaders

Another PCIM Europe in the books, this time completely digital. SEMIKRON followed suit with online presentations and webinars to showcase the latest product updates. Semikron presented the eMPack as a solution for Automotive traction applications with two presentations in the eMoblity Forum by Oliver Tamm and Ingo Rabl. Also, Stefan Häuser, Bernhard Eichler, and Emiliano Meza held two live webinars about the solutions for the smart grid and the high-power modules in the field of renewables and drives.

Power electronics engineers understand the complexity of power module selection for their specific applications. With SemiSel 5, SEMIKRON offers a new simulation tool to ease this burden. Starting with a blank sheet of paper, the team created SemiSel 5 around the needs of power electronics developers. With its brand-new user interface, power module selection is even easier through only five simple steps. Webinar details  In the first section of this webinar, Martin Röblitz will guide visitors through the new features of SemiSel 5. He will also show which additional features are available, especially for registered users, and how they make SemiSel even better. In the second section, he will run a complete simulation together. In only five steps, he will get from the selection of the topology to the detailed analysis of the simulation results. Afterward, there will be plenty of time for questions. With this knowledge, visitors will have the ability to select the power modules they need faster and with more confidence.

Designing a reliable wind converter is an increasingly difficult task with the ever-growing power requirements. The highly reliable, sintered SKiiP 4 has had a power boost. This highly integrated package provides a further 25% increase in power. SKiiP SKiiP is a proven platform with millions of units in the field, allowing for continuous improvement in reliability and performance. Design effort is reduced through an integrated package including a power module, driver, current sensors & cooler. Reliability is increased with sintering and solderless pressure contact technology, eliminating solder fatigue. Additionally, the baseplate-less design reduces chip temperatures and mechanical stress from temperature swings. reliability and performance The latest SKiiP 4 allows for improved reliability and performance in a backward-compatible package The latest SKiiP 4 allows for improved reliability and performance in a backward-compatible package. The new High-Performance Cooling (HPC) technology achieves this by reducing thermal resistance from chip to coolant. Chip configurations can also be specifically tailored for reduced chip temperature swing in line- and rotor-side converters. Key Takeaways  Learn how to exploit the full performance potential of a SKiiP 4 with sintered chips to reach up to 25% more output power. Understand how a solution based on SKiiP 4 can be optimized for generator-side wind converters. Learn how the SKiiP 4 on a High-Performance Cooler can fit into all custom mechanical constructions and reach unprecedented compactness of converter designs.​​​​​​​ Get in touch with SEMIKRON to customize a SKiiP 4 for special power, performance, or IGBT driver setup and requirements.​​​​​​​